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2026 China (Shanghai) International Semiconductor Exhibition
Communications, Telecommunications, Electronics
2026 China (Shanghai) International Semiconductor Exhibition is a key China Exhibitions event in Pudong New Area, China — meet China Suppliers, plan China Sourcing and travel with your China Sourcing Agent Trade-China EU.
Dates: 2026-06-03 – 2026-06-05
Exhibition overview
City Pudong New Area, Shanghai
Venue / Address Shanghai New International Expo Centre
Organizer Shanghai Fengyuan Exhibition Service Co., Ltd.
Co-organizer Shanghai Fengyuan Exhibition Service Co., Ltd.
Exhibit scope
Semiconductor equipment
- packaging equipment
- diffusion equipment
- welding equipment
- cleaning equipment
- testing equipment
- refrigeration equipment
- oxidation equipment
- thinning machines
- dicing machines
- placement machines
- single crystal furnaces
- oxidation furnaces
- grinding machines
- heat treatment equipment
IC design
- IC and related electronic product design
- IC products and application technology
- IC test methods and test instruments
- IC design and design tools
- IC manufacturing and packaging
- EDA
- IP design
- embedded software
- digital circuit design
- analog and mixed-signal circuit design
- integrated circuit layout design
- IDM
- Fabless factory
- etc.
Wafer manufacturing and packaging
- wafer manufacturing
- SiP advanced packaging
- OSATs
- EMS
- OEMs
- IDM
- silicon wafers and IC packaging carrier boards
- printed circuit boards
- packaging substrates and equipment
- assembly and testing
- etc.
- packaging design
- testing
- equipment and application manufacturing and packaging testing
Integrated circuit manufacturing
- wafer manufacturing plants
- wafer foundries
- analog integrated circuits
- digital integrated circuits
- analog hybrid integrated circuit manufacturing
- integrated circuit terminal products
- etc.
Packaging and testing supporting equipment
- test probe station
- probe card
- testing machine
- sorting machine
- packaging equipment
- packaging substrate
- lead frame bonding wire
- wire bonding
- welding test
- automated testing
- laser cutting and others
- abrasive fluid
- dicing fluid
- sealing film (glue) high-temperature tape
Third-generation semiconductors
- third-generation semiconductors SiC
- gallium nitride GaN
- wafers
- substrates
- packaging
- testing
- optoelectronic devices (light-emitting diodes LED
- laser LD
- detector UV)
- power electronic devices (diodes
- MOSFET
- JFET
- BJT
- IGBT
Semiconductor Materials
- Silicon wafers and silicon-based materials
- silicon wafers
- single-crystal silicon
- germanium-silicon materials
- SO1 materials
- silicon materials and compound semiconductor materials for solar cells
- quartz products
- graphite products
- antistatic materials
- photoresists and their supporting reagents
- wafer tapes
- photomasks
- electronic gases
- specialty chemical gases
Electronic Components
- Resistors
- capacitors
- potentiometers
- electron tubes
- heat sinks
- electromechanical components
- connectors
- discrete semiconductor devices/IGBTs
- electroacoustic devices. Laser devices
- electronic display devices
- optoelectronic devices
- sensors
- power supplies
- switches
Introduction
2026 China (Shanghai) International Semiconductor Exhibition is a trade fair in Pudong New Area, China, held at Shanghai New International Expo Centre.
European buyers can meet suppliers and channel partners here. Leave your brief with Trade-China EU for specialist follow-up.
At a glance
- Venue: Shanghai New International Expo Centre
- City: Pudong New Area
Plan your visit
Planning to attend 2026 China (Shanghai) International Semiconductor Exhibition? Buy a visitor briefing below for €50 — exhibitor categories, expected counts, registration path and tips for foreign visitors. After payment a Trade-China EU specialist sends the details.